Solder Paste
For Electronic Device and Semiconductor packaging
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• Low Voiding rate (average voiding rate below 15%) |
DWQ401 | |
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DWQ401UF (IC bump forming) |
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DWQ401PK (IC bump forming) |
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• Ultra - Fine Pitch (available T6, T7, micro assembly solution) |
PN451 (IC flip chip bonding) |
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• Water Soluble (Environmental stability with excellent print characteristics) |
WS931 | |
| WS931PK | ||
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• Zero Halogen (High reliability guaranteed) |
QT459DE | |
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QT459DEUF (IC application) |
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• Fine Pitch (High throughput SMT process solution) |
PN436 | |
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• For Low Temp. alloy (Applicable Sn/Bi, Sn/Bi/Ag lead-free alloy) |
DWQ631 | |
| XT963 | ||
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• For Tin-Lead alloy (Applicable Sn/Pb, Sn/Pb/Ag alloy) |
AM218FT | |
| • HEAT SINK | HSXT996 | |
| • Solder Paste Jetting (Jet Printing) | ||
| • PoP Solder Paste | ||
| Dispense | Zero Halogen | DS459DE |
| Low voiding rate | DS401 | |
| Laser soldering | DS436 | |
| • HEAT SINK | HSXT996 |
