Solder Paste

     For Electronic Device and Semiconductor packaging

Print

• Low Voiding rate

 (average voiding rate below 15%)

DWQ401
DWQ401UF

(IC bump forming)

DWQ401PK
(IC bump forming)

• Ultra - Fine Pitch

 (available T6, T7, micro assembly solution)  

PN451
(IC flip chip bonding)

• Water Soluble

 (Environmental stability with excellent print

  characteristics)

XT931
XT931PK

• Zero Halogen

 (High reliability guaranteed)

QT459DE

QT459DEUF

(IC application)

• Fine Pitch

 (High throughput SMT process solution)

PN436

• For Low Temp. alloy

 (Applicable Sn/Bi, Sn/Bi/Ag lead - free alloy)

DWQ631
XT963

• For Tin-Lead alloy

 (Applicable Sn/Pb, Sn/Pb/Ag alloy)

AM218FT

• HEAT SINK

HSXT996

Dispense

Zero Halogen

DS459DE

Low voiding rate

DS401

Laser soldering

DS436

• HEAT SINK

HSXT996

DWQ401

Ultra-Low void lead-free solder paste
averaging voiding rate below 15%

QT459DE

Zero Haogen,
High Electronic Reliability

PN436

High throughput SMT process solution