Solder Bar


     - Wave Soldering Application Alloy

     Less 20% Dross Formation Than Other Brand  Solder Bar
     Keep 7-8 Hours Mirror Surface on Solder Pot
 

High Silver Content

• Sn/3.0Ag/0.5Cu SAC305 (E9650)
• Sn/3.0Ag SAC305CX (9650CX)

Low Silver Content

• Sn/0.3Ag/0.7Cu SAC0307
• Sn/0.3Ag 0307CX

No Silver Content

• Sn/0.7Cu/Ni NAP100
• Sn/Ni NAP100CX


     - Alloy Properties

Alloy System

SAC305 NAP100 SAC0307
Physical Properties
M/P 217-218℃ 227℃ 217-227℃
Density 7.4 7.3 7.3
Elongation(%) 50 41.2 49
Electrical & Thermal Properties
Specific Heat 219 219 170
Thermal Conductivity (W/M-K) 57.15 57 57.36
Electrical Resistivity (µΩ-cm) 12.1 10.15 12.1
Thermal Fatigue Properties

200 cycles / 400hrs

(-40℃/+125℃)

Pass Pass Pass

840 cycles / 400hrs

(-40℃/+85℃)

Pass Pass Pass

1000-1500 cycles / 400hrs

(-40℃/+125℃)

Pass Pass Pass
Soldering Properties
Solder Joint Less shine Sn/Cu Shine Less shine Sn/Cu
Wetting Time (sec) at 260 ℃ 0.45 0.814 1.10


■ MB Solder Bar & Solder Ball

     - Specialized in high working temp. (350-500℃)soldering alloy

     Strong Anti-Oxidation ability on high work temp.  
     Less 20% dross formation rate than conventional solder bar
     Keep 1-1.5 Hours mirror surface on solder pot under 500℃


High Silver Content •Sn/3.0Ag/0.5Cu MB-SAC305 (E9650)
Low Silver Content •Sn/0.3Ag/0.7Cu MB-SAC0307
No Silver Content •Sn/Cu/Ni

MB-NAP100

* R.O.C. Patent No. I  366495), Ni-Modified Sn/Cu SnCu0.7Ni0.05AlxPy

•Sn/0.7Cu MB-D9930C

NAP100®

A new generation product- silver free alloy. R.O.C patent no. 1366495