IT and Telegram

The New Development for Communication Materials that help you expand possibility to create the technology that will revolutionize tomorrow
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In the big data era, the fifth-generation (5G) mobile communication network brings out innovative assembly technologies. The telecom industry represent the cutting-edge technological applications, because of the fine size and complexity, It relies heavily electrical reliability and high mechanical performance solder materials, as well as, new electrical assembly solutions support.

For grasping the latest trend, Dyfenco has expanded high-performance assembly materials to cope with the challenges of high electrical reliability, fine (extra fine) feature, high thermal and electrical conductivity, good process yield rate and enable to gain better assembly resulting.
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Mobile Phone
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Wearable Devices
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Power Supply
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Camera Modules and Flexible Circuit Board Assembly
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Network Infrastructure Servers, Routers, switches, Antenna, Wireless Modems
Solder Paste (printing and dispensing)
Products Properties Compable Alloys
QT459DEX Ultra Fine PitchAssembly, Halogen Free
T5/6/7
Sti®HighReliability(*)
Sn/3.0Ag/0.5Cu
DWQ401 Low voiding, Fine PitchAssembly
T3/4/4.5
Sn/3.0Ag/0.5Cu
Sn/0.3Ag/0.7Cu
PN451 Ultra Fine PitchAssembly
T5/6/7
Sn/3.0Ag/0.5Cu
PN436 Hailed-Free, Fine pitch assembly
T3/4/4.5
Sn/3.0Ag/0.5cu
Sn/0.3Ag/0.7Cu
DS436
DS401
Dispensing
T3/4
Sn/3.0Ag/0.5cu
Sn/0.3Ag/0.7Cu
Note: Sti® reinforced SAC305 based lead-free solder alloy
Liquid Flux
Products Properties
K8418A
Hyper-Reliable Liquid Flux
Guaranteed for its incomparable long-term reliability without compromising any soldering performance. It is specially designed not only for high-demanding EMS but also to avoid all potential flux defects after long-term electronics service including green cooper-corrosion, copper wire dissolution, white residue precipitation, leading to electric device failure.
K500
Rosin Free, Low solid
Formulated with proprietary activator system with adequate percentage of rosin for improving thermal stability. K500 applied to the product line needs clean level.
ZHF-7600
Halogen-Free, Low solid
No clean, provides continuous high-speed hand soldering applications
Solder Wire
- Available Robotic and Manual Soldering
- Available ultra-fine 0.2mm wire for micro-assembly applications
Products Properties Compable Alloys
HF961 Halogen Free Excellent wettability, no white flux residues Sn/3.0Ag/0.5Cu
Sn/0.3Ag/0.7Cu
NAP100 (*)
2799 No-Clean, utility formulation enhance soldering speed time Sn/0.3Ag/0.7Cu
Sn/0.7Cu
GamPlus1688 No clean, High efficiency soldering performance Sn/0.3Ag/0.7Cu
Sn/0.7Cu
SS302 Compatible with Stainless soldering or other hard-to-solder surface Sn/0.3Ag/0.7Cu
Sn/0.7Cu
Note: NAP100 (Ni modified) lead-free alloy, Taiwan patent no. I 366495