IT and Telegram
The New Development for Communication
Materials that help you expand possibility to create the
technology that will revolutionize tomorrow
In the big data era, the fifth-generation (5G) mobile communication network brings out innovative
assembly technologies. The telecom industry represent the cutting-edge technological applications,
because of the fine size and complexity, It relies heavily electrical reliability and high
mechanical performance solder materials, as well as, new electrical assembly solutions support.
For grasping the latest trend, Dyfenco has expanded high-performance assembly materials to cope with the challenges of high electrical reliability, fine (extra fine) feature, high thermal and electrical conductivity, good process yield rate and enable to gain better assembly resulting.
For grasping the latest trend, Dyfenco has expanded high-performance assembly materials to cope with the challenges of high electrical reliability, fine (extra fine) feature, high thermal and electrical conductivity, good process yield rate and enable to gain better assembly resulting.
Mobile Phone
Wearable Devices
Power Supply
Camera Modules
and Flexible
Circuit Board Assembly
Network Infrastructure Servers,
Routers, switches, Antenna,
Wireless Modems
Solder Paste (printing and dispensing)
| Products | Properties | Compable Alloys |
|---|---|---|
| QT459DEX |
Ultra Fine PitchAssembly, Halogen Free T5/6/7 |
Sti®HighReliability(*) Sn/3.0Ag/0.5Cu |
| DWQ401 |
Low voiding, Fine PitchAssembly T3/4/4.5 |
Sn/3.0Ag/0.5Cu Sn/0.3Ag/0.7Cu |
| PN451 |
Ultra Fine PitchAssembly T5/6/7 |
Sn/3.0Ag/0.5Cu |
| PN436 |
Hailed-Free, Fine pitch assembly T3/4/4.5 |
Sn/3.0Ag/0.5cu Sn/0.3Ag/0.7Cu |
|
DS436 DS401 |
Dispensing T3/4 |
Sn/3.0Ag/0.5cu Sn/0.3Ag/0.7Cu |
Note: Sti® reinforced SAC305 based lead-free solder alloy
Liquid Flux
| Products | Properties |
|---|---|
|
K8418A Hyper-Reliable Liquid Flux |
Guaranteed for its incomparable long-term reliability without compromising any soldering performance. It is specially designed not only for high-demanding EMS but also to avoid all potential flux defects after long-term electronics service including green cooper-corrosion, copper wire dissolution, white residue precipitation, leading to electric device failure. |
|
K500 Rosin Free, Low solid |
Formulated with proprietary activator system with adequate percentage of rosin for improving thermal stability. K500 applied to the product line needs clean level. |
|
ZHF-7600 Halogen-Free, Low solid |
No clean, provides continuous high-speed hand soldering applications |
Solder Wire
- Available Robotic and Manual Soldering
- Available ultra-fine 0.2mm wire for micro-assembly applications
- Available Robotic and Manual Soldering
- Available ultra-fine 0.2mm wire for micro-assembly applications
| Products | Properties | Compable Alloys |
|---|---|---|
| HF961 | Halogen Free Excellent wettability, no white flux residues |
Sn/3.0Ag/0.5Cu Sn/0.3Ag/0.7Cu NAP100 (*) |
| 2799 | No-Clean, utility formulation enhance soldering speed time |
Sn/0.3Ag/0.7Cu Sn/0.7Cu |
| GamPlus1688 | No clean, High efficiency soldering performance |
Sn/0.3Ag/0.7Cu Sn/0.7Cu |
| SS302 | Compatible with Stainless soldering or other hard-to-solder surface |
Sn/0.3Ag/0.7Cu Sn/0.7Cu |
Note: NAP100 (Ni modified) lead-free alloy, Taiwan patent no. I 366495