LED Lighting
We provide excellent thermal fatigue resistance with long-term reliability soldering materials for
LED light market

The LCD assembly is one of the fastest changing, customer expectations for reliability are high for
several applications such as Automotive and Outdoor lighting, requiring better lumen maintenance
over an extended period.
Dyfenco has made significant investment in Research and Development of LED lighting technologies related to LED assembly solutions, heating and structural (reliability) analysis, all of which contribute to our ability to deliver what customers want. Dyfenco continuous to provide high-thermal, high-reliability soldering material which are ideally suited for high reliability LED’s applications.
Dyfenco has made significant investment in Research and Development of LED lighting technologies related to LED assembly solutions, heating and structural (reliability) analysis, all of which contribute to our ability to deliver what customers want. Dyfenco continuous to provide high-thermal, high-reliability soldering material which are ideally suited for high reliability LED’s applications.
Solder Paste
for middle to high powder LED package
DWQ401
Low-Voiding Solder Paste
DWQ401 is specially formulated to solve voiding issue, and minimized potential defects. With its
unique material composition DWQ401 offers a consistently high anti-oxidation performance and is
perfectly suited for automotive application. .
QT459DEX
Ultra Fine, High-Performance Solder Paste
A halogen-free, no-clean lead-free solder paste that enables customers to quickly and
efficiently meet major trends in the automotive and transportation industries
PN451
Ultra fine for Mini LED application
PN451 is specially formulated to solve voiding issue, and minimized potential defects. With its
unique material composition PN451 offers a consistently high anti-oxidation performance and is
perfectly suited for automotive application. .
QT459DE
High-Performance Solder Paste
A halogen-free, no-clean lead-free solder paste that enables customers to quickly and
efficiently meet major trends in the automotive and transportation industries
Solder Paste
for low to middle powder LED package
DWQ631
Low temperature (Sn/Bi and Sn/Bi/Ag) application
DWQ631 is an air reflow, Sn/Bi and Sn/Bi/Ag , no clean lead free solder paste designed for a
broad range of low temperature SMT operation. DWQ631 provide good wettability, high adhesion
with low interface thermal resistance.
XT963
Low temperature (Sn/Bi and Sn/Bi/Ag) applications
XT963 new formulation with high activation characteristics to provide low temperature
fluctuation during reflow process, can effectively decrease the soldering defect rate.
XT963 provide high reliability moisture resistance and anti-collapse properties, it is the most suitable for heat sink modules SMT assembly field.
XT963 provide high reliability moisture resistance and anti-collapse properties, it is the most suitable for heat sink modules SMT assembly field.
Solder Wire
for end cap assembly, linear strip board-to-board connections
HF961
High Electronic Reliability Solder Wire
- Halogen-Free, offers a consistently high surface resistance (SIR) that prevents the risks of
electrochemical migration.
- Zero Halogen-Free, specification lower than JEITA ET-7304 requirement.
- Suitable for use in high electronic reliability demanded industry (Automotive, Mobile devices..)
- Low residues formation, clear non-tacky.
- Shiny solder appearance joint
- Zero Halogen-Free, specification lower than JEITA ET-7304 requirement.
- Suitable for use in high electronic reliability demanded industry (Automotive, Mobile devices..)
- Low residues formation, clear non-tacky.
- Shiny solder appearance joint
Al201
Solder to Aluminum High Electronic Reliability Solder Wire
- Compatible with Aluminum soldering
- Strong active agent design provide good wettability (No polishing required)
- Al201 is selected materials suitable for rapid light heating achieves high workability.
- Strong active agent design provide good wettability (No polishing required)
- Al201 is selected materials suitable for rapid light heating achieves high workability.
2799
High Electronic Reliability Solder Wire
- Utility formulation enhance soldering speed time
- Specialized in continuous soldering operation
- Specialized in continuous soldering operation
PT525
Solve A/B adhesive non-curing by Pt catalyst
- Low spattering.
- SHigh electronic reliability performance, passed by SIR / Copper mirror/ Copper corrosion test.
- The flux left no white powder after soldering.
- Wire no break, no flux voiding.
- SHigh electronic reliability performance, passed by SIR / Copper mirror/ Copper corrosion test.
- The flux left no white powder after soldering.
- Wire no break, no flux voiding.
Flux
ZHF-7600
, Halogen free, Low solid Liquid Flux
Special halogen free flux is our high technical product, developed in compliance to
international standards for electronic assemblies. ZHF-7600 flux has superior activators for the
perfect wetting of soldered surface and component leads on the PCBs. It provided very low
bridging on bottom side QFP’s with 144-168 leads as well as good hole-fill and solderballing.
ZHF-7600 provides good lead-free solder joint appearance with an uniform spread, tackless
residues.
K500
Rosin Free, Low solid Liquid Flux
Formulated with proprietary activator system with adequate percentage of rosin for improving
thermal stability. It performed the broadest process window with low defects rate. K500
performance assure you trouble free compliance with new environmental regulations.
K8418A
Hyper-Reliable Liquid Flux
Guaranteed for its incomparable long-term reliability without compromising any soldering
performance. It is specially designed not only for high-demanding EMS but also to avoid all
potential flux defects after long-term electronics service including green cooper-corrosion,
copper wire dissolution, white residue precipitation, leading to electric device failure.
