LED Lighting

We provide excellent thermal fatigue resistance with long-term reliability soldering materials for LED light market
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The LCD assembly is one of the fastest changing, customer expectations for reliability are high for several applications such as Automotive and Outdoor lighting, requiring better lumen maintenance over an extended period.

Dyfenco has made significant investment in Research and Development of LED lighting technologies related to LED assembly solutions, heating and structural (reliability) analysis, all of which contribute to our ability to deliver what customers want. Dyfenco continuous to provide high-thermal, high-reliability soldering material which are ideally suited for high reliability LED’s applications.
Solder Paste
for middle to high powder LED package

DWQ401

Low-Voiding Solder Paste
DWQ401 is specially formulated to solve voiding issue, and minimized potential defects. With its unique material composition DWQ401 offers a consistently high anti-oxidation performance and is perfectly suited for automotive application. .

QT459DEX

Ultra Fine, High-Performance Solder Paste
A halogen-free, no-clean lead-free solder paste that enables customers to quickly and efficiently meet major trends in the automotive and transportation industries

PN451

Ultra fine for Mini LED application
PN451 is specially formulated to solve voiding issue, and minimized potential defects. With its unique material composition PN451 offers a consistently high anti-oxidation performance and is perfectly suited for automotive application. .

QT459DE

High-Performance Solder Paste
A halogen-free, no-clean lead-free solder paste that enables customers to quickly and efficiently meet major trends in the automotive and transportation industries
Solder Paste
for low to middle powder LED package

DWQ631

Low temperature (Sn/Bi and Sn/Bi/Ag) application
DWQ631 is an air reflow, Sn/Bi and Sn/Bi/Ag , no clean lead free solder paste designed for a broad range of low temperature SMT operation. DWQ631 provide good wettability, high adhesion with low interface thermal resistance.

XT963

Low temperature (Sn/Bi and Sn/Bi/Ag) applications
XT963 new formulation with high activation characteristics to provide low temperature fluctuation during reflow process, can effectively decrease the soldering defect rate.
XT963 provide high reliability moisture resistance and anti-collapse properties, it is the most suitable for heat sink modules SMT assembly field.
Solder Wire
for end cap assembly, linear strip board-to-board connections

HF961

High Electronic Reliability Solder Wire
- Halogen-Free, offers a consistently high surface resistance (SIR) that prevents the risks of electrochemical migration.
- Zero Halogen-Free, specification lower than JEITA ET-7304 requirement.
- Suitable for use in high electronic reliability demanded industry (Automotive, Mobile devices..)
- Low residues formation, clear non-tacky.
- Shiny solder appearance joint

Al201

 Solder to Aluminum High Electronic Reliability Solder Wire
- Compatible with Aluminum soldering
- Strong active agent design provide good wettability (No polishing required)
- Al201 is selected materials suitable for rapid light heating achieves high workability.

2799

High Electronic Reliability Solder Wire
- Utility formulation enhance soldering speed time
- Specialized in continuous soldering operation

PT525

Solve A/B adhesive non-curing by Pt catalyst
- Low spattering.
- SHigh electronic reliability performance, passed by SIR / Copper mirror/ Copper corrosion test.
- The flux left no white powder after soldering.
- Wire no break, no flux voiding.
Flux

ZHF-7600

, Halogen free, Low solid Liquid Flux
Special halogen free flux is our high technical product, developed in compliance to international standards for electronic assemblies. ZHF-7600 flux has superior activators for the perfect wetting of soldered surface and component leads on the PCBs. It provided very low bridging on bottom side QFP’s with 144-168 leads as well as good hole-fill and solderballing. ZHF-7600 provides good lead-free solder joint appearance with an uniform spread, tackless residues.

K500

Rosin Free, Low solid Liquid Flux
Formulated with proprietary activator system with adequate percentage of rosin for improving thermal stability. It performed the broadest process window with low defects rate. K500 performance assure you trouble free compliance with new environmental regulations.

K8418A

Hyper-Reliable Liquid Flux
Guaranteed for its incomparable long-term reliability without compromising any soldering performance. It is specially designed not only for high-demanding EMS but also to avoid all potential flux defects after long-term electronics service including green cooper-corrosion, copper wire dissolution, white residue precipitation, leading to electric device failure.
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