Solder Preforms

   Available in various shapes :

Washer OD Outside Diameter
Min = 1.2mm(0.0472in)
Max = 40mm(1.5748in)
T Thickness
Min = 0.05mm(0.0020in)
Max = 2.5mm(0.0984in)
ID Inside Diameter
Min = 0.6mm(0.0236in)
Max = 36mm(1.3780in)
Rectangle Side A
Min = 0.5mm(0.0200in)
Max = 100mm(3.9370in)
T Thickness
Min = 0.05mm(0.0020in)
Max = 2.5mm(0.0984in)
Side B
Min = 0.5mm(0.0200in)
Max = 70mm(2.7599in)
Disc OD Outside Diameter
Min = =0.3mm(0.0118in)
Max = 62mm(2.4410in)
T Thickness
Min = 0.05mm(0.0020in)
Max = 2.5mm(0.0984in)
Ring
(Flux Cored only)
OD Outside Diameter
Min = 1.0mm(0.0394in)
Max = 19mm(0.7480in)
WD Wire Diameter
Min = 0.3mm(0.0118in)
Max = 2.0mm(0.0787in)
ID Inside Diameter
Min = 0.4mm(0.0158in)
Max = 15mm(0.5906in)
Processing conditions: ID>=WD
WD(mm):0.3,0.4,0.5,0.6,0.65,0.8,1.0,1.2,1.6,2.0
Sleeve OD Outside Diameter
Min = 2.0mm(0.0787in)
Max = 15mm(0.5906in)
H Height
Min = 2.0mm(0.0787in)
Max = 10mm(0.3937in)
ID Inside Diameter
Min = 1.8mm(0.0709in)
Max = 14.5mm(0.5709in)
Ribbon W Width
Min = 0.5mm(0.0197in)
Max = 70mm(2.7560in)
L Length
Consult us about the length specification
T Thickness
Min = 0.05mm(0.0020in)
Max = 0.35mm(0.0138in)
Solder Coated Rectangle/Ribbon
W Width
Min = 1.0mm(0.0394in)
Max = 70mm(2.7559in)
TC Thickness of coated solder(each side)
Min = 0.01mm(0.0004in)
Max = 0.025mm(0.0010in)
T Thickness of mother metal
Min = 0.05mm(0.0020in)
Max = 0.3mm(0.0118in)


Dyfenco preform solutions provide a wide range of advantages in electronic circuit assembly applications especially in applications difficult to access with soldering irons or standard reflow process. 


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Solder Preform

Dyfenco preform solutions provide a wide range of advantages in electronic circuit assembly applications especially in applications difficult to access with soldering irons or standard reflow process.