Semiconductor
Semiconductor Assembly / Packaging Materials and
Related Technologies
Developments in the Semiconductor industry have triggered rapid growth of the automotive,
communication, alternative energy, computing and consumer electronics market in the last decade. To
stay ahead of the semiconductor technology curve, Dyfenco keeps a highly experienced and skilled RD
team that continuously research and develop the very latest semiconductor technology
Flip Chip Packaging
System in package (SiP)
MEMS & Sensors Packaging
Embedded Die Technology
Dyfenco offers the broadest range of soldering materials for semiconductor
assembly/packaging, and these products are manufactured under
precisely-controlled conditions to ensure semiconductor-grade quality.
Typical Product Attributes:
| Products | Properties | Compable Alloys | |||
|---|---|---|---|---|---|
| Die attach, Chip attach | BGA,CSP | Flip Chip | Wafer Bumping | ||
| DWQ401PK | Halogen Free(NoBr and Cl Ions) Low voiding Extra Fine Particle Size (T6, T7) | * | * | * | * |
|
XT931PK Solder Paste |
Water soluble | * | * | * | * |
|
PN451 Solder Paste |
Ultra Fine Particle Size (T6,7) For BGA, IC applications | * | * | * | * |
|
AM218FT Solder Paste |
High-Pb contents No Clean |
* | * | * | * |
|
DS451 Tack flux |
For Ultra Fine application No Clean |
* | * | * | * |
|
DS401 Tack flux |
Low voiding performance No Clean |
* | * | * | * |
|
ZHF7600 Liquid Flux |
Zero Halogen High electronic reliability |
* | * | * | * |
|
K6 Liquid Flux |
Zero Halogen High quality performance |
* | * | * | * |
Liquid Flux
| Alloy | Pb/10Sn/2Ag | Pb/5Sn | Pb/5Sn/2.5Ag |
|---|---|---|---|
| Die Attach | v | v | v |
| Melting point | 267-290oC | 308-312oC | 287-296oC |
| Flux-less (SSDAgrade) | v | v | v |
| Flux content(no-clean) | v | v | v |
| Dia. | Available 0.20~1.0mm | v | v |
Through a unique extrusion drawing process, we offer exceptional quality and performance in a
variety
of high-pb solder wires specially for ultra fine (0.20mm) wire. The surface of wires are extremely
shiny, free of organic contamination and oxides.
The flux-content wires has been developed to fullfit the highest requirements and guarantee a
consistent bondline thickness and very low void rate.