Semiconductor

Semiconductor Assembly / Packaging Materials and Related Technologies
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Developments in the Semiconductor industry have triggered rapid growth of the automotive, communication, alternative energy, computing and consumer electronics market in the last decade. To stay ahead of the semiconductor technology curve, Dyfenco keeps a highly experienced and skilled RD team that continuously research and develop the very latest semiconductor technology
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Flip Chip Packaging
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System in package (SiP)
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MEMS & Sensors Packaging
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Embedded Die Technology
Dyfenco offers the broadest range of soldering materials for semiconductor assembly/packaging, and these products are manufactured under precisely-controlled conditions to ensure semiconductor-grade quality.
Typical Product Attributes:
Products Properties Compable Alloys
Die attach, Chip attach BGA,CSP Flip Chip Wafer Bumping
DWQ401PK Halogen Free(NoBr and Cl Ions) Low voiding Extra Fine Particle Size (T6, T7) * * * *
XT931PK
Solder Paste
Water soluble * * * *
PN451
Solder Paste
Ultra Fine Particle Size (T6,7) For BGA, IC applications * * * *
AM218FT
Solder Paste
High-Pb contents
No Clean
* * * *
DS451
Tack flux
For Ultra Fine application
No Clean
* * * *
DS401
Tack flux
Low voiding performance
No Clean
* * * *
ZHF7600
Liquid Flux
Zero Halogen
High electronic reliability
* * * *
K6
Liquid Flux
Zero Halogen
High quality performance
* * * *
Liquid Flux
Alloy Pb/10Sn/2Ag Pb/5Sn Pb/5Sn/2.5Ag
Die Attach v v v
Melting point 267-290oC 308-312oC 287-296oC
Flux-less (SSDAgrade) v v v
Flux content(no-clean) v v v
Dia. Available 0.20~1.0mm v v
Through a unique extrusion drawing process, we offer exceptional quality and performance in a variety of high-pb solder wires specially for ultra fine (0.20mm) wire. The surface of wires are extremely shiny, free of organic contamination and oxides. The flux-content wires has been developed to fullfit the highest requirements and guarantee a consistent bondline thickness and very low void rate.