A new generation product- silver free alloy. R.O.C patent no. 1366495
Take Sn/Cu as basis jointing a trace of Ni and P becoming lead-free Sn/Cu/Ni alloy to improve solder’s wettability and liquidity. It is able to reduce IMC formation rate and has marvelous solder joint performance in wave soldering and HASL process than Sn/37Pb alloy. Meanwhile its solder joint performance in lead-free wave soldering is smoother and brighter than high silver content alloy such as SAC305.
NAP100- Process Parameter & Pilot Run Test
NAP100 Microstructure Analysis
NAP100 Reliability Test (2)- PCBA Microstructure Analysis
NAP100 Reliability Test (3)- PCBA Tin whisker Analysis