PN436

High throughput SMT process solution

Deposition  Test Pattern: QFP Pad (fine pitch)

Stencil Thickness  :	130 microns
Stencil Material  :	Stainless Steel
Printer   :	DEK  ELAi
Printing Speed  :	60 mm/s
Stencil Separation  Speed  :	0.3 mm/s
Stencil Separation  Speed  :	40N
Atmosphere  :	25℃, 50%HR

Demonstrations of stencil aperture clogging

PN436 No obvious clogging between QFP lead frame after 20 prints.	After 20 prints, the surface of QFP lead frame is observed to be uneven, causing noticeable clogging.

Printing-ability Analysis QFN (pitch 0.4mm)

Good Soldering Performance for 0201 Chip

Consistent Soldering Performance After 12 HRs Printing 

Still perfect soldering performance	Solder powder Oxidation
PN436	Conversational

In the process of SMT printing, the stencil needs cleaning every 4 or 5 prints. With usage of  PN436  lead free solder paste, the cleaning frequency is substantially lowered, saving lots of time and costs of stencil cleaning, which in turn helps improve productivity.
 
PN436 lead free solder paste carries out perfect printing performance with excellent deposition, stable viscosity after continuous printing for 8 hours and full and complete printing shape without clogging.