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Green electronics industries face more pressure in product safety and environment protection under RoHS and WEEE rule, the usage of the typical tin/lead solder for more than 50 years is being compelled to lead-free solder. Currently, Tin, Silver and copper (Sn/Ag/Cu, aka SAC) alloys are applied on the market. However, the melting point of SAC solder is 217℃ to 220℃, for which is higher than the Sn/37Pb 183℃. Consequently, auto wave solder and reflow processing have entered a high temperature components era. Because of this 40℃ difference, high temperature operation will directly impact products quality and reliability, especially on the components and PCBs with complex PCBA production process, such as issues with PCB cracks and IC de-laminations.

In order to help customers solving the relative reliability questions when leading the lead free process into the regular manufacturing process. Dyfenco provides sufficient technical support to our customers in the new lead-free solder material development、new process development assistance and PCBA reliability analysis.