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HiQ® Lead Free Solder Paste
HiQ® Lead free solder paste are products developed to meet environmental requirements with excellent stability and workability equal to conventional Tin-Lead paste. The slower wetting speeds and high reflow temperature associated with lead-free alloys require enhanced flux activity. HiQ® lead-free solder paste has novel flux systems that are specifically formulated to perform high chemical reliability, good preservation stability, perfect solderability and low generation of solder balls.
SeriesCodeAlloy CompositionMelting PointFlux DesinatorViscosityDOWNLOAD
AEE9650-AESn/3.0Ag/0.5Cu217REL0200Pas
 SAC0307-AESn/0.3Ag/0.7Cu217~227REL0200Pas
 D4200B-AESn/58Bi138REL0200Pas
LFE9650-LFSn/3.0Ag/0.5Cu217REL1200Pas
 SAC0307-LFSn/0.3Ag/0.7Cu217~227REL1200Pas
 D4200B-LFSn/58Bi138REL1200Pas
HSFE9650-HSFSn/3.0Ag/0.5Cu217REL0200Pas
 SAC0307-HSFSn/0.3Ag/0.7Cu217~227REL0200Pas
 D4200B-HSFSn/58Bi138REL0200Pas