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HiQ® Solder Preforms
HiQ® Solder Preforms effectively increase your productivity. HiQ® Solder preforms suitable in SMT reflow PCB assembly process, provide an easy way to selectively increase solder volume by using standard pick and place equipment. To get correct amount of solder volume enable to improve consistently good, strong solder joints specially in thinner stencils, smaller components or boards, and PCBA reliability.

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