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HiQ Lead FreeSolder Bar
The quality of HiQ® solder bar is guaranteed by using high purity meals and manufacturing under strict quality control in each of process. All solder bars meet or exceed the requirements of QQ--S-571、ASTM B32 and IPC (J-STD-006) standard. HiQ® solder bar is produced in a propriety process to remove the impurity and natural oxides, which result in lower dross rate and effectively decrease in soldering defects like as non-wetting, bridging and voids. The characteristics of HiQ® lead free solder provide bright solder appearance and excellent solder joint strength.
SeriesCodeAlloy CompositionMelting PointGravity(g/cm^3)DOWNLOAD
Mid-High TemperatureE9650
9650CX
Sn/3.0Ag/0.5Cu
Sn/3.0Ag
217~218
221~222
7.36
7.35
 SAC0307A+
0307CX
Sn/0.3Ag/0.7Cu
Sn/0.3Ag
217~227
221
7.3
7.36
 E9650SSn/2.5Ag/0.8Cu/0.5Sb217~2187.40
 E9550CSn/4.0Ag/0.5Cu217~2277.44
 E9650C1Sn/3.8Ag/0.7Cu217~2217.42
High TemperatureD9930C
Sn100
Sn/0.7Cu/X
Pure Tin
227
232
7.30
7.28
 D9650Sn/3.5Ag2217.36
 E9700ASn/1Ag/2Cu227~3007.32
 D9800CSn/2Cu217~2687.34
 D9500SSn/5Sb2387.25
Low TemperatureD4800ISn/52In1187.30
 D4200BSn/58Bi1387.40
 E8900ZSn/8Zn/3Bi191~1967.30
 D9100ZSn/9Zn1997.28